Title :
Lithographically defined integrable air-lifted bow-tie antennas
Author :
Kim, Jungkwun JK ; Cheng, Xiaoyu ; Ahn, Hyochun ; Elles, David Senior ; Yoon, Yong-Kyu YK
Author_Institution :
Dept. of Electr. Eng., Univ. at Buffalo, the State Univ. of New York, Buffalo, NY, USA
Abstract :
A vertically placed monopole type bow-tie antenna has been fabricated using dynamic mode multidirectional ultraviolet (UV) lithography and polymer metallization on a non-transparent printing wiring board. A photopatternable liquid state polyurethane is utilized to define a bow-tie antenna backbone with a height of 4.5 mm, a top portion width of 3 mm, a bottom portion width of 800 ¿m, and a flare angle of 30°, which allows a resonant radiation frequency of 12 GHz. The printing wiring board with a thickness of 508 ¿m has a drilled hole with a diameter of 800 ¿m through which backside tilting exposure has been performed to define the vertical bow-tie slab. Conductor backed coplanar waveguide (CB-CPW) has been used for feeding the air-lifted bow-tie antenna. The measurement results show a resonant radiation frequency of 12.34 GHz and a 10 dB-bandwidth of 7%. It shows an omnidirectional far-field radiation pattern based on simulation. Different shapes of air-lifted backbone for 12 GHz resonant radiation has been fabricated and the performance has been simulated using a high frequency structure simulator tool.
Keywords :
antenna radiation patterns; bow-tie antennas; coplanar waveguide components; integrated circuit metallisation; lithography; monopole antennas; air-lifted bow-tie antennas; conductor backed coplanar waveguide; frequency 12 GHz; monopole antenna; multidirectional ultraviolet lithography; nontransparent printing wiring board; omnidirectional farfield radiation pattern; photopatternable liquid state polyurethane; polymer metallization; Conductors; Lithography; Metallization; Polymers; Printing; Resonance; Resonant frequency; Slabs; Spine; Wiring; LF55GN; air-lifted antenna; bow-tie antenna; inclined exposure; multidirectional UV lithography;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442287