• DocumentCode
    2007552
  • Title

    Analysis on thermo-mechanical stress of thermoelectric module

  • Author

    Hori, Y. ; Kusano, D. ; Ito, T. ; Izumi, K.

  • Author_Institution
    Central Res. Inst. of Electr. Power Ind., Tokyo, Japan
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    328
  • Lastpage
    331
  • Abstract
    This paper describes the thermo-mechanical performance of thermoelectric modules. A heat cycle test was performed in order to analyze the thermo-mechanical performance of modules of three different cross sectional area of elements. Modules of all the three types declined in generated output with the increase of heat cycles. It is considered that the decline of generated output was caused by the increase in the internal electrical resistance of each module. The increase of internal electrical resistance was caused by the poor contact between a thermoelectric element and a Cu electrode due to the deterioration of the solder at the contact with the increase of heat cycles.
  • Keywords
    cooling; heat transfer; thermal stresses; thermoelectric devices; heat cycle test; internal electrical resistance; poor contact; solder deterioration; thermo-mechanical stress; thermoelectric module; Contacts; Electric resistance; Electrodes; Performance analysis; Performance evaluation; Resistance heating; Testing; Thermal stresses; Thermoelectricity; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843396
  • Filename
    843396