DocumentCode
2007552
Title
Analysis on thermo-mechanical stress of thermoelectric module
Author
Hori, Y. ; Kusano, D. ; Ito, T. ; Izumi, K.
Author_Institution
Central Res. Inst. of Electr. Power Ind., Tokyo, Japan
fYear
1999
fDate
Aug. 29 1999-Sept. 2 1999
Firstpage
328
Lastpage
331
Abstract
This paper describes the thermo-mechanical performance of thermoelectric modules. A heat cycle test was performed in order to analyze the thermo-mechanical performance of modules of three different cross sectional area of elements. Modules of all the three types declined in generated output with the increase of heat cycles. It is considered that the decline of generated output was caused by the increase in the internal electrical resistance of each module. The increase of internal electrical resistance was caused by the poor contact between a thermoelectric element and a Cu electrode due to the deterioration of the solder at the contact with the increase of heat cycles.
Keywords
cooling; heat transfer; thermal stresses; thermoelectric devices; heat cycle test; internal electrical resistance; poor contact; solder deterioration; thermo-mechanical stress; thermoelectric module; Contacts; Electric resistance; Electrodes; Performance analysis; Performance evaluation; Resistance heating; Testing; Thermal stresses; Thermoelectricity; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1999. Eighteenth International Conference on
Conference_Location
Baltimore, MD, USA
ISSN
1094-2734
Print_ISBN
0-7803-5451-6
Type
conf
DOI
10.1109/ICT.1999.843396
Filename
843396
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