• DocumentCode
    2007792
  • Title

    A MEMS variable Faraday cage as tuning element for integrated silicon micromachined cavity resonators

  • Author

    Dancila, D. ; Ekkels, P. ; Rottenberg, X. ; Huynen, I. ; De Raedt, W. ; Tilmans, H.A.C.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    723
  • Lastpage
    726
  • Abstract
    This paper reports the design and the realization of a variable-sized MEMS-based Faraday cage, used to tune the resonant frequency of a silicon micromachined cavity resonator. The Faraday cage is defined by a 2D-array of electrostatically controllable metal cantilevers. The cantilever array effectively shields an enclosed (air) volume (forming the Faraday cage) located inside the micromachined cavity resonator. The Faraday cage perturbs the electromagnetic field distribution inside the cavity resonator and provides a means to electrically tune the resonant frequency of the resonator. In this realization, the cavity resonator was micromachined using bulk KOH etching in silicon and assembled in a low temperature die-to-wafer soldering process. The electrical feeding was realized in thin-film metallizations and the resonator is formed as a two-chip assembly. We measured a maximal frequency tuning of 1.2 GHz at 60 GHz with a tuning voltage of 16 VDC.
  • Keywords
    cantilevers; cavity resonators; etching; micromachining; micromechanical resonators; soldering; MEMS variable Faraday cage; bulk KOH etching; cantilever array; electrical feeding; electromagnetic field distribution; electrostatically controllable metal cantilevers; integrated silicon micromachined cavity resonators; low temperature die-to-wafer soldering; resonant frequency; thin-film metallization; tuning element; two-chip assembly; variable-sized MEMS-based Faraday cage; Assembly; Cavity resonators; Electric variables control; Electromagnetic fields; Etching; Micromechanical devices; Resonant frequency; Silicon; Temperature; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442306
  • Filename
    5442306