• DocumentCode
    2008167
  • Title

    A new capacitive type MEMS microphone

  • Author

    Leinenbach, Christina ; Van Teeffelen, Kathrin ; Laermer, Franz ; Seidel, Helmut

  • Author_Institution
    Corp. Res. Microsyst., Robert Bosch GmbH, Stuttgart, Germany
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    659
  • Lastpage
    662
  • Abstract
    A new capacitive type of MEMS microphone is presented. In contrast to existing technologies which are highly specialized for this particular type of application, our approach is based on a standard process and layer system which has been in use for more than a decade now for the manufacturing of inertial sensors. For signal conversion, a mixed-signal ASIC with digital sampling of the microphone capacitance is used. The MEMS microphone yields high signal-to-noise performance (58 dB) after mounting it in a standard LGA-type package. It is well-suited for a wide range of potential applications and demonstrates the universal scope of the used process technology.
  • Keywords
    capacitive sensors; micromechanical devices; microphones; sampling methods; LGA-type package; capacitive type MEMS microphone; digital sampling; inertial sensors; microphone capacitance; mixed-signal ASIC; signal conversion; Biomembranes; Capacitive sensors; Compressive stress; Micromechanical devices; Microphones; Packaging; Residual stresses; Sensor systems and applications; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442322
  • Filename
    5442322