• DocumentCode
    2008256
  • Title

    Transport properties of Co/sub 1-x/Fe/sub x/Sb/sub 3/

  • Author

    Yang, J. ; Meisner, G.P. ; Uhe, C.

  • Author_Institution
    Mater. & Process. Lab., GM R&D Center, Warren, MI, USA
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    458
  • Lastpage
    461
  • Abstract
    The role of iron on the cobalt site of the filled skutterudites has yet to be firmly ascertained. To address this question, we prepared a series of samples of the form Co/sub 1-x/Fe/sub x/Sb/sub 3/ with x=0, 0.5, 1, 2, 5 and 10 at% by induction melting. We performed measurements of thermal conductivity, thermopower, resistivity, Hall effect, X-ray diffraction, and magnetization. The presence of iron reduces dramatically the lattice thermal conductivity. Iron doping increases the hole concentration resulting in a concomitant reduction of the room temperature Seebeck coefficient. We also observed phonon drag effects at low temperature. Magnetization studies indicate the development of a paramagnetic state. The subtle role of iron in creating lattice defects will also be discussed.
  • Keywords
    Hall effect; X-ray diffraction; antimony alloys; cobalt alloys; electrical resistivity; iron alloys; magnetisation; paramagnetic materials; thermal conductivity; thermoelectric power; (CoFe)Sb/sub 3/; Co/sub 1-x/Fe/sub x/Sb/sub 3/; Hall effect; X-ray diffraction; filled skutterudites; hole concentration; induction melting; lattice thermal conductivity; magnetization; paramagnetic state; phonon drag effects; resistivity; room temperature Seebeck coefficient; thermal conductivity; thermopower; Cobalt; Conductivity measurement; Hall effect; Iron; Lattices; Magnetization; Performance evaluation; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843430
  • Filename
    843430