Soft-X-ray-charged vertical electrets and its application to electrostatic transducers

Author

Honzumi, Makoto ; Ueno, Ai ; Hagiwara, Kei ; Suzuki, Yuji ; Tajima, Toshifumi ; Kasagi, Nobuhide

Author_Institution

Univ. of Tokyo, Tokyo, Japan

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

635

Lastpage

638

Abstract

A novel charging method for vertical electrets in narrow gaps using soft X-rays has been developed. Electrets can be charged up to the depth 20~30 times of the gap opening. With the present charging technology, MEMS electret transducers can be fabricated using a single wafer without assembling process. We demonstrate performance of vertical electrets using early prototype of in-plane accelerometer. Under 18.7 Â¿m_p-p external oscillation at 500 Hz, 30 mV output has been obtained without external bias voltage. Surface potential for 80 Â¿m-deep vertical electrets is estimated to be 52 V.

Keywords

X-rays; assembling; electrets; electrostatic devices; micromechanical devices; surface potential; transducers; MEMS electret transducers; assembling process; charging method; electrostatic transducers; external bias voltage; external oscillation; gap opening; in-plane accelerometer; present charging technology; soft X-rays; soft-X-ray-charged vertical electrets; surface potential; Accelerometers; Assembly; Electrets; Electrostatics; Micromechanical devices; Prototypes; Surface charging; Transducers; Voltage; X-rays;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442328

Filename

5442328