Title :
Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution
Author :
Shakeri, Kaveh ; Bakir, Muhannad ; Meindl, James D.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
An ultralow inductance I/O interconnect, called a coaxial polymer pillar (CoPP) is introduced that is compatible with sea of polymer pillars (SoPP) recently presented. Polymer pillars are highly process-integrated and mechanically flexible (compliant) electrical-optical I/O interconnections that mitigate thermomechanical expansion mismatches. The 100x smaller parasitic inductance of the CoPP (in the range of 0.1 pH) compared to the inductance of a solder bump or a regular polymer pillar makes it an excellent I/O interconnect technology for power distribution. The density of CoPPs may exceed 105/cm2.
Keywords :
VLSI; integrated circuit interconnections; integrated circuit noise; polymers; power distribution; VLSI; coaxial polymer pillars; electrical-optical I/O interconnections; ground bounce; input/output interconnects; power distribution; simultaneous switching noise; thermomechanical expansion mismatch; ultra-low inductance I/O interconnect; Coaxial components; Dielectrics; Frequency; Inductance; Packaging; Parasitic capacitance; Polymers; Power distribution; Power systems; Voltage;
Conference_Titel :
SOC Conference, 2004. Proceedings. IEEE International
Print_ISBN :
0-7803-8445-8
DOI :
10.1109/SOCC.2004.1362356
