• DocumentCode
    2008920
  • Title

    A permittivity-based MEMS affinity glucose sensor with integrated temperature measurements

  • Author

    Huang, Xian ; Li, Siqi ; Schultz, Jerome S. ; Wang, Qian ; Lin, Qiao

  • Author_Institution
    Mech. Eng. Dept., Columbia Univ., New York, NY, USA
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    899
  • Lastpage
    902
  • Abstract
    We present a proof-of-concept MEMS affinity sensor that measures the changes in dielectric properties of poly(acrylamide-ran-3-acrylamidophenylboronic acid) (PAA-ran-PAAPBA) polymer due to its specific, reversible binding with glucose. This sensor comprises capacitive electrodes sandwiching a solution of PAA-ran-PAAPBA polymer. Binding with glucose induces changes in the permittivity of the polymer, which can be measured as changes in capacitance to allow determination of the glucose concentration. A thin-film temperature sensor is also integrated within the device to maintain the polymer solution at a constant temperature via closed-loop control. Testing of the device with varying glucose-sensitive polymer compositions has shown that the device is capable of detecting glucose at physiologically relevant concentrations with excellent sensitivity and specificity. These results indicate that this MEMS-based sensor can be practically used for long-term, stable continuous glucose monitoring.
  • Keywords
    chemical sensors; electrodes; microsensors; permittivity; permittivity measurement; polymers; sugar; temperature measurement; temperature sensors; thin film sensors; MEMS affinity glucose sensor; capacitive electrodes; closed-loop control; dielectric properties; integrated temperature measurements; poly(acrylamide-ran-3-acrylamidophenylboronic acid); thin-film temperature sensor; Capacitance measurement; Capacitive sensors; Dielectric measurements; Electrodes; Micromechanical devices; Permittivity measurement; Polymers; Sugar; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442352
  • Filename
    5442352