Title : 
A permittivity-based MEMS affinity glucose sensor with integrated temperature measurements
         
        
            Author : 
Huang, Xian ; Li, Siqi ; Schultz, Jerome S. ; Wang, Qian ; Lin, Qiao
         
        
            Author_Institution : 
Mech. Eng. Dept., Columbia Univ., New York, NY, USA
         
        
        
        
        
        
            Abstract : 
We present a proof-of-concept MEMS affinity sensor that measures the changes in dielectric properties of poly(acrylamide-ran-3-acrylamidophenylboronic acid) (PAA-ran-PAAPBA) polymer due to its specific, reversible binding with glucose. This sensor comprises capacitive electrodes sandwiching a solution of PAA-ran-PAAPBA polymer. Binding with glucose induces changes in the permittivity of the polymer, which can be measured as changes in capacitance to allow determination of the glucose concentration. A thin-film temperature sensor is also integrated within the device to maintain the polymer solution at a constant temperature via closed-loop control. Testing of the device with varying glucose-sensitive polymer compositions has shown that the device is capable of detecting glucose at physiologically relevant concentrations with excellent sensitivity and specificity. These results indicate that this MEMS-based sensor can be practically used for long-term, stable continuous glucose monitoring.
         
        
            Keywords : 
chemical sensors; electrodes; microsensors; permittivity; permittivity measurement; polymers; sugar; temperature measurement; temperature sensors; thin film sensors; MEMS affinity glucose sensor; capacitive electrodes; closed-loop control; dielectric properties; integrated temperature measurements; poly(acrylamide-ran-3-acrylamidophenylboronic acid); thin-film temperature sensor; Capacitance measurement; Capacitive sensors; Dielectric measurements; Electrodes; Micromechanical devices; Permittivity measurement; Polymers; Sugar; Temperature measurement; Temperature sensors;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
         
        
            Conference_Location : 
Wanchai, Hong Kong
         
        
        
            Print_ISBN : 
978-1-4244-5761-8
         
        
            Electronic_ISBN : 
1084-6999
         
        
        
            DOI : 
10.1109/MEMSYS.2010.5442352