Title :
A study on the performance improvement of 3D inspection equipment
Author :
Young Mo Koo ; Kyu Ho Lee
Author_Institution :
Dept. of Electr. Eng., Yeonsung Univ., Anyang, South Korea
Abstract :
In this paper, heights of bumps on the flip chip substrate in semiconductor package are inspected by using 3D inspection equipment. As a 3D inspection equipment, white light scanning interferometry with large FOV (Field Of View) is used. Experimental 3D data repeatability test results for the same flat bumps and round bumps of each substrate are shown. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.
Keywords :
electronic engineering computing; flip-chip devices; inspection; integrated circuit packaging; integrated circuit testing; interferometry; semiconductor industry; substrates; test equipment; 3D data inspection machine; 3D data repeatability test; 3D inspection equipment; flat bumps; flip chip substrate; performance improvement; round bumps; semiconductor package; white light scanning interferometry; 3D Inspection Equipment; WSI(White Light Scanning Interferometry);
Conference_Titel :
Soft Computing and Intelligent Systems (SCIS) and 13th International Symposium on Advanced Intelligent Systems (ISIS), 2012 Joint 6th International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4673-2742-8
DOI :
10.1109/SCIS-ISIS.2012.6505395
