Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks

Author

Auersperg, Jürgen ; Rzepka, Sven ; Michel, Bernd

Author_Institution

Micro Mater. Center, Fraunhofer ENAS, Chemnitz, Germany

fYear

2011

fDate

8-12 May 2011

Firstpage

1

Lastpage

3

Abstract

Miniaturization and increasing functional integration push the development of feature sizes of advanced CMOS down to the nanometer range. New low-k and ultra low-k materials in Back-end of line (BEoL) structures cause new challenges for reliability analysis and prediction, in addition. A combined numerical/experimental approach will be explained towards optimizing fracture and fatigue resistance of BEoL-structures by making use of bulk and interface fracture concepts. The risk of near-chip-edge and near-bump cracking in BEoL-structures with lead-free as well as copper-pillar interconnects is analyzed and optimized under chip package interaction (CPI) and FC-reflow-soldering, in particular.

Keywords

CMOS integrated circuits; crack detection; failure analysis; fracture; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; low-k dielectric thin films; reflow soldering; three-dimensional integrated circuits; 3D integration; Backend of line structure; CMOS; FC reflow soldering; chip package interaction; chip/package interaction; copper pillar interconnects; crack investigation; damage investigation; fatigue resistance; fracture resistance; functional integration; interface fracture; low-k BEoL stacks; near bump cracking; near chip edge; Copper; Delamination; Materials; Reliability; Residual stresses; Stress measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International

Conference_Location

Dresden

ISSN

pending

Print_ISBN

978-1-4577-0503-8

Type

conf

DOI

10.1109/IITC.2011.5940283

Filename

5940283