DocumentCode
2009282
Title
Copper Interconnection with Tungsten Cladding for UlSI
Author
Cho, J.S.H. ; Kang, H-K. ; Beiley, M.A. ; Wong, S. Simon
Author_Institution
Stanford University, CA
fYear
1991
fDate
28-30 May 1991
Firstpage
39
Lastpage
40
Keywords
Copper; Degradation; Dry etching; Electromigration; Integrated circuit interconnections; Metallization; Plugs; Temperature; Tungsten; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on
Conference_Location
Oiso, Japan
Type
conf
DOI
10.1109/VLSIT.1991.705979
Filename
705979
Link To Document