Title : 
Neuromedicator - a disposable drug delivery system with silicon microprobes for neural research
         
        
            Author : 
Spieth, S. ; Schumacher, A. ; Kallenbach, C. ; Messner, S. ; Zengerle, R.
         
        
            Author_Institution : 
Inst. fur Mikro- und Informationstechnik, Hahn-Schickard-Gesellschaft e.V. (HSG-IMIT), Villingen-Schwenningen, Germany
         
        
        
        
        
        
            Abstract : 
We report on a novel disposable drug delivery system for neural research which allows to infuse 16 discrete liquid portions of 0.25 ¿L directly into neural cell tissue. The system comprises an 11 à 14.5 à 3 mm3 fluidic chip with a pluggable electrical micro connector and two 8-mm-long micromachined silicon fluidic microprobes with a cross-sectional area of 250 à 250 ¿m2. A pearl chain-like fluidic structure with spherical segments was developed which stores and predefines the required drug liquid portions for the whole time of operation. The micropump principle for liquid delivery is based on the local, irreversible thermal expansion of microspheres embedded into polydimethylsiloxane (PDMS).
         
        
            Keywords : 
bioMEMS; biological tissues; cellular biophysics; drug delivery systems; electric connectors; microfluidics; micropumps; neurophysiology; polymers; printed circuits; silicon; thermal expansion; discrete liquid portions; disposable drug delivery system; embedded system; fluidic chip; irreversible thermal expansion; micromachined silicon fluidic microprobes; micropump principle; microstructured PCB; neural cell tissue; neural research; neuromedicator; pearl chain-like fluidic structure; pluggable electrical microconnector; polydimethylsiloxane; silicon microprobes; size 8 mm; spherical segments; Connectors; Drug delivery; Electrodes; Fabrication; Fluidic microsystems; Microfluidics; Pharmaceutical technology; Probes; Silicon; Thermal expansion;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
         
        
            Conference_Location : 
Wanchai, Hong Kong
         
        
        
            Print_ISBN : 
978-1-4244-5761-8
         
        
            Electronic_ISBN : 
1084-6999
         
        
        
            DOI : 
10.1109/MEMSYS.2010.5442373