Author :
Marchal, Paul ; Van der Plas, Geert ; Eneman, Geert ; Moroz, Victor ; Badaroglu, Mustafa ; Mercha, Abdelkarim ; Thijs, Steven ; Linten, Dimitri ; Guruprasad, Katti ; Stucchi, Michele ; Vandevelde, Bart ; Prins, Herman O. ; Cherman, Vladimir ; Croes, Krist
Abstract :
The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high performance or consumer markets systems, 3D offers a myriad of opportunities. We will review the different opportunities, indicate process availability and remaining challenges from both design and technology perspective.
Keywords :
semiconductor industry; three-dimensional integrated circuits; 3D technology roadmap; consumer market system; heterogeneous 3D integration; semiconductor industry; Mobile communication; Random access memory; Silicon; Stacking; Stress; Three dimensional displays; Through-silicon vias; 3D; Characterization;
