DocumentCode
2009554
Title
3D technology roadmap and status
Author
Marchal, Paul ; Van der Plas, Geert ; Eneman, Geert ; Moroz, Victor ; Badaroglu, Mustafa ; Mercha, Abdelkarim ; Thijs, Steven ; Linten, Dimitri ; Guruprasad, Katti ; Stucchi, Michele ; Vandevelde, Bart ; Prins, Herman O. ; Cherman, Vladimir ; Croes, Krist
Author_Institution
IMEC, Leuven, Belgium
fYear
2011
fDate
8-12 May 2011
Firstpage
1
Lastpage
3
Abstract
The semiconductor industry is witnessing a major shift towards heterogeneous 3D integration. Whether companies are active in high performance or consumer markets systems, 3D offers a myriad of opportunities. We will review the different opportunities, indicate process availability and remaining challenges from both design and technology perspective.
Keywords
semiconductor industry; three-dimensional integrated circuits; 3D technology roadmap; consumer market system; heterogeneous 3D integration; semiconductor industry; Mobile communication; Random access memory; Silicon; Stacking; Stress; Three dimensional displays; Through-silicon vias; 3D; Characterization;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location
Dresden
ISSN
pending
Print_ISBN
978-1-4577-0503-8
Type
conf
DOI
10.1109/IITC.2011.5940300
Filename
5940300
Link To Document