DocumentCode
2009583
Title
A Novel Double-Self-Alicned TiSi2/TiN Contact with Selective Cvd W Plug for Submicron Device and Interconnect Applications
Author
Wang, M.S. ; Bradbury, D. ; Hu, E.K. ; Chiu, K.Y.
Author_Institution
Hewlett Packard, Circuit Technology R&D, CA
fYear
1991
fDate
28-30 May 1991
Firstpage
41
Lastpage
42
Keywords
Chemical technology; Contact resistance; Integrated circuit interconnections; Nitrogen; Plugs; Surface resistance; Tin; Titanium; Tungsten; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on
Conference_Location
Oiso, Japan
Type
conf
DOI
10.1109/VLSIT.1991.705980
Filename
705980
Link To Document