DocumentCode
2009697
Title
Estimating reliability and throughput of source-synchronous wave-pipelined interconnect
Author
Teehan, Paul ; Lemieux, Guy G F ; Greenstreet, Mark R.
Author_Institution
Univ. of British Columbia, Vancouver, BC
fYear
2009
fDate
10-13 May 2009
Firstpage
234
Lastpage
243
Abstract
Wave pipelining has gained attention for NoC interconnect by its promise of high bandwidth using simple circuits. Reliability issues must be addressed before wave pipelining can be used in practice; so, we develop a statistical model of dynamic timing uncertainty. We show that it is important to distinguish between static and dynamic sources of timing uncertainty, because source-synchronous wave pipelining is much more sensitive to the latter. We use HSPICE simulations to develop a model for a wave pipelined link in a 65 nm CMOS process and apply a statistical approach to determine the achievable throughput at acceptable bit-error rates. Reliability estimates show that a modest amount of dynamic noise can cut achievable throughput in half for a ten-stage wave-pipelined link, and will further degrade longer links. After accounting for noise, traditional globally synchronous design is shown to offer higher throughput than the wave-pipelined design.
Keywords
CMOS logic circuits; SPICE; integrated circuit interconnections; multiprocessor interconnection networks; network-on-chip; pipeline processing; CMOS process; HSPICE simulation; NoC interconnect reliability estimation; bit-error rate estimation; dynamic timing uncertainty; network-on-chip; pipelining practice; size 65 nm; source-synchronous wave-pipelined interconnect; synchronous design dynamic noise; wave-pipelined link; Bandwidth; Bit error rate; CMOS process; Integrated circuit interconnections; Network-on-a-chip; Pipeline processing; Semiconductor device modeling; Throughput; Timing; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Networks-on-Chip, 2009. NoCS 2009. 3rd ACM/IEEE International Symposium on
Conference_Location
San Diego, CA
Print_ISBN
978-1-4244-4142-6
Electronic_ISBN
978-1-4244-4143-3
Type
conf
DOI
10.1109/NOCS.2009.5071472
Filename
5071472
Link To Document