• DocumentCode
    2009697
  • Title

    Estimating reliability and throughput of source-synchronous wave-pipelined interconnect

  • Author

    Teehan, Paul ; Lemieux, Guy G F ; Greenstreet, Mark R.

  • Author_Institution
    Univ. of British Columbia, Vancouver, BC
  • fYear
    2009
  • fDate
    10-13 May 2009
  • Firstpage
    234
  • Lastpage
    243
  • Abstract
    Wave pipelining has gained attention for NoC interconnect by its promise of high bandwidth using simple circuits. Reliability issues must be addressed before wave pipelining can be used in practice; so, we develop a statistical model of dynamic timing uncertainty. We show that it is important to distinguish between static and dynamic sources of timing uncertainty, because source-synchronous wave pipelining is much more sensitive to the latter. We use HSPICE simulations to develop a model for a wave pipelined link in a 65 nm CMOS process and apply a statistical approach to determine the achievable throughput at acceptable bit-error rates. Reliability estimates show that a modest amount of dynamic noise can cut achievable throughput in half for a ten-stage wave-pipelined link, and will further degrade longer links. After accounting for noise, traditional globally synchronous design is shown to offer higher throughput than the wave-pipelined design.
  • Keywords
    CMOS logic circuits; SPICE; integrated circuit interconnections; multiprocessor interconnection networks; network-on-chip; pipeline processing; CMOS process; HSPICE simulation; NoC interconnect reliability estimation; bit-error rate estimation; dynamic timing uncertainty; network-on-chip; pipelining practice; size 65 nm; source-synchronous wave-pipelined interconnect; synchronous design dynamic noise; wave-pipelined link; Bandwidth; Bit error rate; CMOS process; Integrated circuit interconnections; Network-on-a-chip; Pipeline processing; Semiconductor device modeling; Throughput; Timing; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Networks-on-Chip, 2009. NoCS 2009. 3rd ACM/IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-4142-6
  • Electronic_ISBN
    978-1-4244-4143-3
  • Type

    conf

  • DOI
    10.1109/NOCS.2009.5071472
  • Filename
    5071472