DocumentCode
2009904
Title
New dimensionless number for superhydrophobicity study of micron/submicron patterned surfaces
Author
Chen, Longquan ; Lee, Yi-Kuen
Author_Institution
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
1051
Lastpage
1054
Abstract
This paper reports a systematic study of geometric effect of roughness on hydrophobicity by a series of post arrays ranging from several hundreds microns to submicron. These devices were fabricated using projection/contact photolithography and etched by Deep RIE with different heights. A 1 ¿m parylene C layer was then deposited on these devices to improve hydrophobicity and the apparent contact angles were measured. It was found that the apparent contact angle increases with increasing the height of posts and there is a best diameter for each series of devices with a same spacing. With the help of dimensional analysis, all the measured apparent contact angles can be collapsed by a new dimensionless number, Bulk Aspect Ratio (BAR). In addition to a small solid fraction, the superhydrophobic surfaces were found with a bulk aspect ratio larger than 4.
Keywords
contact angle; hydrophobicity; photolithography; sputter etching; bulk aspect ratio; contact angle; deep RIE; dimensionless number; micron-submicron patterned surface; projection-contact photolithography; reactive ion etching; superhydrophobicity; Etching; Fabrication; Goniometers; Lithography; Micromechanical devices; Resists; Rough surfaces; Silicon; Solids; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442390
Filename
5442390
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