• DocumentCode
    2009904
  • Title

    New dimensionless number for superhydrophobicity study of micron/submicron patterned surfaces

  • Author

    Chen, Longquan ; Lee, Yi-Kuen

  • Author_Institution
    Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    1051
  • Lastpage
    1054
  • Abstract
    This paper reports a systematic study of geometric effect of roughness on hydrophobicity by a series of post arrays ranging from several hundreds microns to submicron. These devices were fabricated using projection/contact photolithography and etched by Deep RIE with different heights. A 1 ¿m parylene C layer was then deposited on these devices to improve hydrophobicity and the apparent contact angles were measured. It was found that the apparent contact angle increases with increasing the height of posts and there is a best diameter for each series of devices with a same spacing. With the help of dimensional analysis, all the measured apparent contact angles can be collapsed by a new dimensionless number, Bulk Aspect Ratio (BAR). In addition to a small solid fraction, the superhydrophobic surfaces were found with a bulk aspect ratio larger than 4.
  • Keywords
    contact angle; hydrophobicity; photolithography; sputter etching; bulk aspect ratio; contact angle; deep RIE; dimensionless number; micron-submicron patterned surface; projection-contact photolithography; reactive ion etching; superhydrophobicity; Etching; Fabrication; Goniometers; Lithography; Micromechanical devices; Resists; Rough surfaces; Silicon; Solids; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442390
  • Filename
    5442390