Title : 
Organic photoconductive dielectrophoresis by using titanium oxide phthalocyanine for micro-particles manupulation
         
        
            Author : 
Yu, Tung-Ming ; Yang, Shi-Mo ; Huang, Hang-Ping ; Ku, Meng-Yen ; Tseng, Sheng-Yang ; Liu, Ming-Huei ; Hsu, Long ; Liu, Cheng-Hsien
         
        
            Author_Institution : 
Nat. Chiao-Tung Univ., Hsinchu, Taiwan
         
        
        
        
        
        
            Abstract : 
This paper reports our updating development for the organic photoconductive dielectrophoresis (OPDEP) by using titanium oxide phthalocyanine (TiOPc) material for the manipulation of micro-objects. The advantages of organic photoconductive material include non-toxicity, low cost, easy coating fabrication, flexibility, panchromaticity and high photosensitivity. TiOPc has the high photoconductivity and the optical absorptions in the near infrared region (550 - 850 nm) to be a candidate of the light-sensitive charge generation layer. OPDEP chip is easily mass-produced by using a spin-coating process. Here, we demonstrate two kinds of the manipulations of micro-particles on our OPDEP chip. Firstly, the trapping and movement of single micro-particle is achieved by the ring shaped virtual electrode. Secondly, the steel rim shaped virtual electrode is designed to rotate micro-particles and characterize the OPDEP induced force.
         
        
            Keywords : 
electrophoresis; photochemistry; photoconducting materials; spin coating; titanium compounds; coating fabrication; microparticles manipulation; near infrared region; optical absorptions; organic photoconductive dielectrophoresis; photoconductive material; photosensitivity; spin-coating process; titanium oxide phthalocyanine; Coatings; Costs; Dielectrophoresis; Electrodes; Optical device fabrication; Optical materials; Organic materials; Photoconducting materials; Photoconductivity; Titanium;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
         
        
            Conference_Location : 
Wanchai, Hong Kong
         
        
        
            Print_ISBN : 
978-1-4244-5761-8
         
        
            Electronic_ISBN : 
1084-6999
         
        
        
            DOI : 
10.1109/MEMSYS.2010.5442407