• DocumentCode
    2011086
  • Title

    Parallel assembly of 01005 surface mount technology components with 100% yield

  • Author

    Hoo, Ji ; Lingley, Andrew ; Baskaran, Rajashree ; Xiong, Xiaorong ; Böhringer, Karl F.

  • Author_Institution
    Univ. of Washington, Seattle, WA, USA
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    532
  • Lastpage
    535
  • Abstract
    This paper demonstrates a novel method to perform the delivery and assembly of standard 01005 format (0.016"×0.008", 0.4 mm×0.2 mm) thin-film resistors and monolithic ceramic capacitors with a programmable batch assembly process that leads to 100% yield within tens of seconds, that is high volume manufacturing compatible. By characterizing the electrical performance of functional industrial-grade components assembled onto test substrates, we extend previous stochastic assembly work performed with dummy parts, validating our assembly methodology.
  • Keywords
    assembling; batch processing (industrial); ceramic capacitors; surface mount technology; thin film resistors; electrical performance; functional industrial-grade components; high volume manufacturing; monolithic ceramic capacitors; parallel assembly; programmable batch assembly process; stochastic assembly; surface mount technology; test substrates; thin-film resistors; Assembly; Capacitors; Ceramics; Manufacturing industries; Manufacturing processes; Pulp manufacturing; Resistors; Surface-mount technology; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442449
  • Filename
    5442449