DocumentCode
2011086
Title
Parallel assembly of 01005 surface mount technology components with 100% yield
Author
Hoo, Ji ; Lingley, Andrew ; Baskaran, Rajashree ; Xiong, Xiaorong ; Böhringer, Karl F.
Author_Institution
Univ. of Washington, Seattle, WA, USA
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
532
Lastpage
535
Abstract
This paper demonstrates a novel method to perform the delivery and assembly of standard 01005 format (0.016"Ã0.008", 0.4 mmÃ0.2 mm) thin-film resistors and monolithic ceramic capacitors with a programmable batch assembly process that leads to 100% yield within tens of seconds, that is high volume manufacturing compatible. By characterizing the electrical performance of functional industrial-grade components assembled onto test substrates, we extend previous stochastic assembly work performed with dummy parts, validating our assembly methodology.
Keywords
assembling; batch processing (industrial); ceramic capacitors; surface mount technology; thin film resistors; electrical performance; functional industrial-grade components; high volume manufacturing; monolithic ceramic capacitors; parallel assembly; programmable batch assembly process; stochastic assembly; surface mount technology; test substrates; thin-film resistors; Assembly; Capacitors; Ceramics; Manufacturing industries; Manufacturing processes; Pulp manufacturing; Resistors; Surface-mount technology; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442449
Filename
5442449
Link To Document