DocumentCode
20111
Title
Multiparametric Virtual Metrology Model Building by Job-Shop Data Fusion Using a Markov Chain Monte Carlo Method
Author
Tamaki, Kimitoshi ; Kaneko, Shin
Author_Institution
Yokohama Res. Lab., Hitachi, Ltd., Kanagawa, Japan
Volume
26
Issue
3
fYear
2013
fDate
Aug. 2013
Firstpage
319
Lastpage
327
Abstract
This paper proposes a generic methodology for building a multiparametric virtual metrology (VM) model that predicts the chemical-mechanical polishing (CMP) rate in the mass production of many different products in small quantities using multiple tools in a job shop. The VM model must handle inter-individual differences in both products and tools, with multiple parameters. To identify the multiparametric VM model from datasets of small samples collected from the tools in the early stages of mass production, all the datasets are fused together using a Markov chain Monte Carlo method for a hierarchical Bayesian model. The proposed method is validated by simulation experiments using real manufacturing data collected from six tools for seven mixed products. In particular, the 18 parameters of the VM model are identifiable even from a fusion of the datasets with just 10 samples from each of the tools. The root mean square of errors (RMSE) of the variation in the polished amount decreases to 41% when using the APC with the VM model.
Keywords
Bayes methods; Markov processes; Monte Carlo methods; chemical mechanical polishing; job shop scheduling; mass production; mean square error methods; measurement systems; process control; sensor fusion; CMP; Markov chain Monte Carlo method; RMSE; chemical mechanical polishing; hierarchical Bayesian model; job shop data fusion; mass production; multiparametric virtual metrology model building; root mean square error; Advanced process control (APC); Markov chain Monte Carlo (MCMC); chemical-mechanical polishing (CMP); virtual metrology (VM);
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2013.2257897
Filename
6497661
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