• DocumentCode
    20111
  • Title

    Multiparametric Virtual Metrology Model Building by Job-Shop Data Fusion Using a Markov Chain Monte Carlo Method

  • Author

    Tamaki, Kimitoshi ; Kaneko, Shin

  • Author_Institution
    Yokohama Res. Lab., Hitachi, Ltd., Kanagawa, Japan
  • Volume
    26
  • Issue
    3
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    319
  • Lastpage
    327
  • Abstract
    This paper proposes a generic methodology for building a multiparametric virtual metrology (VM) model that predicts the chemical-mechanical polishing (CMP) rate in the mass production of many different products in small quantities using multiple tools in a job shop. The VM model must handle inter-individual differences in both products and tools, with multiple parameters. To identify the multiparametric VM model from datasets of small samples collected from the tools in the early stages of mass production, all the datasets are fused together using a Markov chain Monte Carlo method for a hierarchical Bayesian model. The proposed method is validated by simulation experiments using real manufacturing data collected from six tools for seven mixed products. In particular, the 18 parameters of the VM model are identifiable even from a fusion of the datasets with just 10 samples from each of the tools. The root mean square of errors (RMSE) of the variation in the polished amount decreases to 41% when using the APC with the VM model.
  • Keywords
    Bayes methods; Markov processes; Monte Carlo methods; chemical mechanical polishing; job shop scheduling; mass production; mean square error methods; measurement systems; process control; sensor fusion; CMP; Markov chain Monte Carlo method; RMSE; chemical mechanical polishing; hierarchical Bayesian model; job shop data fusion; mass production; multiparametric virtual metrology model building; root mean square error; Advanced process control (APC); Markov chain Monte Carlo (MCMC); chemical-mechanical polishing (CMP); virtual metrology (VM);
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2013.2257897
  • Filename
    6497661