• DocumentCode
    2011157
  • Title

    A Proactive Wearout Recovery Approach for Exploiting Microarchitectural Redundancy to Extend Cache SRAM Lifetime

  • Author

    Shin, Jeonghee ; Zyuban, Victor ; Bose, Pradip ; Pinkston, Timothy M.

  • Author_Institution
    Univ. of Southern California, Los Angeles, CA
  • fYear
    2008
  • fDate
    21-25 June 2008
  • Firstpage
    353
  • Lastpage
    362
  • Abstract
    Microarchitectural redundancy has been proposed as a means of improving chip lifetime reliability. It is typically used in a reactive way, allowing chips to maintain operability in the presence of failures by detecting and isolating, correcting, and/or replacing components on a first-come, first-served basis only after they become faulty. In this paper, we explore an alternative, more preferred method of exploiting microarchitectural redundancy to enhance chip lifetime reliability. In our proposed approach, redundancy is used proactively to allow non-faulty microarchitecture components to be temporarily deactivated, on a rotating basis, to suspend and/or recover from certain wearout effects. This approach improves chip lifetime reliability by warding off the onset of wearout failures as opposed to reacting to them posteriorly. Applied to on-chip cache SRAM for combating NBTI-induced wearout failure, our proactive wearout recovery approach increases lifetime reliability (measured in mean-time-to-failure) of the cache by about a factor of seven relative to no use of microarchitectural redundancy and a factor of five relative to conventional reactive use of redundancy having similar area overhead.
  • Keywords
    SRAM chips; cache storage; failure analysis; integrated circuit reliability; redundancy; NBTI-induced wearout failure; cache SRAM lifetime; chip lifetime reliability; first-come first-served basis; microarchitectural redundancy; proactive wearout recovery; wearout failures; Degradation; Failure analysis; Fault detection; Maintenance; Microarchitecture; Niobium compounds; Random access memory; Redundancy; Stress; Titanium compounds; lifetime reliability; microarchitectural redundancy; proactive approach; wearout recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Architecture, 2008. ISCA '08. 35th International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    1063-6897
  • Print_ISBN
    978-0-7695-3174-8
  • Type

    conf

  • DOI
    10.1109/ISCA.2008.30
  • Filename
    4556739