DocumentCode :
2011209
Title :
Queueing Generalized Stochastic Colored Timed Petri Nets-based Approach to Modeling for Semiconductor Wafer Fabrication
Author :
Cao, Zheng-Cai ; Qiao, Fei ; Wu, Qi-di
Author_Institution :
Tongji Univ., Shanghai
fYear :
2007
fDate :
May 30 2007-June 1 2007
Firstpage :
2834
Lastpage :
2838
Abstract :
Some of the important characteristics of the semiconductor wafer fabrication factories are re-entrant process flows, a dynamic and uncertain environment, resource sharing, unpredicted machine breakdown, etc. So, the design, implementation, and operation of manufacturing systems is a complex task. Without powerful modeling techniques it is practically impossible to efficiently design a manufacturing system. Modeling the system is a premise work to optimize the properties of the system. In this paper, a modeling approach based on queueing generalized stochastic colored timed Petri-net (QGSCTPN) for semiconductor wafer fabrication is presented. The main idea of this tool is to combine colored timed Petri nets with the queuing systems, and it aims to make simulation over the model more efficient. It also can be used to model various detail of manufacturing system such as re-entrant processing, machine failures, loading and unloading, etc., pertaining to wafer fabrication. Using the industrial example as a case study, this paper aims at presenting some theoretical methods and their application using a modeling tool during the design of manufacturing systems. Finally, the aim of next-step work is put-forward.
Keywords :
Petri nets; queueing theory; semiconductor device manufacture; stochastic processes; generalized stochastic colored timed Petri-net; queuing system; semiconductor wafer fabrication; Electric breakdown; Fabrication; Manufacturing systems; Petri nets; Power system modeling; Production facilities; Resource management; Semiconductor device breakdown; Semiconductor device modeling; Stochastic processes; modeling; queueing generalized stochastic colored timed Petri-net; semiconductor wafer fabrication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Control and Automation, 2007. ICCA 2007. IEEE International Conference on
Conference_Location :
Guangzhou
Print_ISBN :
978-1-4244-0818-4
Electronic_ISBN :
978-1-4244-0818-4
Type :
conf
DOI :
10.1109/ICCA.2007.4376879
Filename :
4376879
Link To Document :
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