DocumentCode
2011238
Title
A novel vertical solder pump structure for through-wafer interconnects
Author
Gu, Jiebin ; Pike, W.T. ; Karl, W.J.
Author_Institution
Dept. of EEE, Imperial Coll. London, London, UK
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
500
Lastpage
503
Abstract
Through wafer interconnection is a critical technology for advanced packaging. Previously, we have proposed a solder pump technology which could complete the via filling through solder reflow. Here, an improved vertical solder-pump structure is presented and successfully demonstrated. This technology allows producing an arbitrary array of highly conductive vias in seconds.
Keywords
integrated circuit interconnections; integrated circuit packaging; reflow soldering; advanced packaging; solder reflow; through-wafer interconnects; vertical solder pump structure; Copper; Educational institutions; Feeds; Filling; Gravity; Metallization; Packaging; Potential energy; Surface tension; Vents;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442457
Filename
5442457
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