• DocumentCode
    2011870
  • Title

    Fabrication of multiple height microstructures using UV lithography on timed-development-and-thermal-reflowed photoresist

  • Author

    Kim, Jungkwun JK ; Lee, Kangsun ; Jee, Hongsub ; Oh, Kwang W. ; Yoon, Yong-Kyu YK

  • Author_Institution
    Dept. of Electr. Eng., Univ. at Buffalo, the State Univ. of New York, Buffalo, NY, USA
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    376
  • Lastpage
    379
  • Abstract
    Multiple height pillar arrays as well as various circular or parabolic microstructures are fabricated by the combination of the timed-development-and-thermal-reflow process and an additional ultraviolet (UV) exposure step. First, uncrosslinked photoresist (SU-8) in a confined region such as a via or trench from the initial lithography step is partially developed in a timed manner to obtain a different development depth while a subsequent thermal treatment above the glass transition temperature of the remaining uncrosslinked polymer allows the polymer to reflow to form an uneven but smooth round shape surface profile, which can be well described using the Young-Laplace equation. Second, an additional UV exposure step to the prepared uneven surface by the back side exposure scheme through a transparent substrate with prepatterned Cr patterns is performed to have pillar arrays with various heights. A 2 by 5 micropillar array with gradually changing heights is successfully demonstrated. Also, a microfluidic channel with a triangular cross section is fabricated for particle sorting.
  • Keywords
    Laplace equations; microfabrication; microfluidics; photoresists; polymers; ultraviolet lithography; UV lithography; Young-Laplace equation; back side exposure scheme; circular microstructures; glass transition temperature; microfluidic channel; multiple height microstructure fabrication; multiple height pillar arrays; parabolic microstructures; round shape surface profile; thermal treatment; timed-development-and-thermal-reflow process; transparent substrate; triangular cross section; uncrosslinked photoresist; uncrosslinked polymer; Differential equations; Fabrication; Glass; Lithography; Microstructure; Polymers; Resists; Shape; Surface treatment; Temperature; multiple height microstructures; thermal reflow; timed development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442486
  • Filename
    5442486