Title : 
Active CMOS-MEMS AFM-like conductive probes for field-emission assisted nano-scale fabrication
         
        
            Author : 
Zhang, Y. ; Santhanam, S. ; Liu, J. ; Fedder, G.K.
         
        
            Author_Institution : 
Carnegie Mellon Univ., Pittsburgh, PA, USA
         
        
        
        
        
        
            Abstract : 
In this paper, a method of fabricating active CMOS-MEMS AFM-like conductive probes with nanometer-sized probe tips for Tip-directed Field-emission Assisted Nanofabrication (TFAN) is reported. We envision an approach using tip-directed chemical vapor deposition (CVD) for the deposition of Si nanowires (SNWs), using field-emitted electrons to locally crack adsorbed precursors (silane/disilane) through direct momentum transfer. This approach will enable control of nanowire geometry during fabrication. The designed active probe consists of three key parts: a thermal bimorph structure actuator, a capacitive sensor and a field emission (FE) probe tip. Unlike the past Spindt process for FE tip fabrication, a single-step probe tip fabrication process on CMOS-MEMS chips is introduced via electron-beam lithography and evaporation technique using PMMA as resist. The mechanism and key growth conditions for Spindt-type tip formation are investigated.
         
        
            Keywords : 
CMOS integrated circuits; nanotechnology; probes; CMOS MEMS chips; active CMOS MEMS AFM-like conductive probes; capacitive sensor; complementary metal-oxide-semiconductor; direct momentum transfer; electron beam lithography; evaporation technique; field emission probe tip; field emitted electrons; microelectromechanical system; nanometer-sized probe tips; nanowire geometry; thermal bimorph structure actuator; tip-directed chemical vapor deposition; tip-directed field emission assisted nanoscale nanofabrication; Actuators; Capacitive sensors; Chemical vapor deposition; Electrons; Fabrication; Geometry; Iron; Nanofabrication; Nanowires; Probes;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
         
        
            Conference_Location : 
Wanchai, Hong Kong
         
        
        
            Print_ISBN : 
978-1-4244-5761-8
         
        
            Electronic_ISBN : 
1084-6999
         
        
        
            DOI : 
10.1109/MEMSYS.2010.5442496