DocumentCode
2012075
Title
Active CMOS-MEMS AFM-like conductive probes for field-emission assisted nano-scale fabrication
Author
Zhang, Y. ; Santhanam, S. ; Liu, J. ; Fedder, G.K.
Author_Institution
Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
336
Lastpage
339
Abstract
In this paper, a method of fabricating active CMOS-MEMS AFM-like conductive probes with nanometer-sized probe tips for Tip-directed Field-emission Assisted Nanofabrication (TFAN) is reported. We envision an approach using tip-directed chemical vapor deposition (CVD) for the deposition of Si nanowires (SNWs), using field-emitted electrons to locally crack adsorbed precursors (silane/disilane) through direct momentum transfer. This approach will enable control of nanowire geometry during fabrication. The designed active probe consists of three key parts: a thermal bimorph structure actuator, a capacitive sensor and a field emission (FE) probe tip. Unlike the past Spindt process for FE tip fabrication, a single-step probe tip fabrication process on CMOS-MEMS chips is introduced via electron-beam lithography and evaporation technique using PMMA as resist. The mechanism and key growth conditions for Spindt-type tip formation are investigated.
Keywords
CMOS integrated circuits; nanotechnology; probes; CMOS MEMS chips; active CMOS MEMS AFM-like conductive probes; capacitive sensor; complementary metal-oxide-semiconductor; direct momentum transfer; electron beam lithography; evaporation technique; field emission probe tip; field emitted electrons; microelectromechanical system; nanometer-sized probe tips; nanowire geometry; thermal bimorph structure actuator; tip-directed chemical vapor deposition; tip-directed field emission assisted nanoscale nanofabrication; Actuators; Capacitive sensors; Chemical vapor deposition; Electrons; Fabrication; Geometry; Iron; Nanofabrication; Nanowires; Probes;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442496
Filename
5442496
Link To Document