Title :
Micromachined capacitors based on automated multilayer electroplating
Author :
Galle, Preston ; Kim, Seong-Hyok ; Shah, Urvi ; Allen, Mark G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A new type of capacitor, based on a high-aspect-ratio 3-dimensional micromachining process, is presented. Submicron layers of alternating metals are deposited by an automated robotic electroplating system. Selective etching of one of the two metals leaves a highly laminated structure with large surface area. To demonstrate the increased surface area, this structure is used as one electrode of a capacitor. A dielectric layer is added by atomic layer deposition (ALD) of alumina. A liquid electrolyte is added and vacuum-infiltrated to form the second electrode. 1.5 nF/mm2 capacitance density is produced with a 10-layer structure.
Keywords :
aluminium; atomic layer deposition; capacitors; electroplating; etching; micromachining; robots; 3-dimensional micromachining process; alternating metals; alumina; atomic layer deposition; automated multilayer electroplating; automated robotic electroplating system; dielectric layer; liquid electrolyte; micromachined capacitor; selective etching; vacuum-infiltration; Capacitors; Electrodes; Energy management; Etching; Fabrication; Lithography; Magnetic multilayers; Micromachining; Nonhomogeneous media; Parasitic capacitance;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442499
