DocumentCode
2012209
Title
Synthesis and thermoelectric properties of nano/micro-meter CoSb3-based bulks processed by in-situ spark plasma sintering
Author
Lu, Q.M. ; Zhang, J.X. ; Zhang, X. ; Wei, Q.
Author_Institution
Key Lab. of Adv. Functional Mater., Beijing Univ. of Technol.
fYear
2006
fDate
6-10 Aug. 2006
Firstpage
148
Lastpage
150
Abstract
Nanostructure materials exhibit different properties from those of corresponding bulk substances, the decrease in the grain size of the material leads to a drastic increase in the density of grain boundaries, which brings out a significant reduction in thermal conductivity, kappa, and so improve the value of thermoelectric figure-of-merit, ZT. But the decreased grain size reduces the electrical conductivity and Seebeck coefficient at the same time. Based on the above reasons, a novel method of in-situ spark plasma sintering (SPS) is used to synthesize CoSb3-based Skutterudite compounds with nano/micro-meter grains by controlling the grain size of raw materials, and the thermoelectric properties are studied systematically. The results indicate that, the ratio of electrical conductivity and thermal conductivity is optimized, and a relative high Seebeck coefficient is obtained at nano/micro-meter scale. As a result, the dimensionless figure of merit ZT is greatly improved for CoSb3, and La0.3FeCo3Sb12, the highest value of ZT of 0.34 and 0.72 is obtained at 700 K for CoSb3 and La0.3FeCo3Sb12 Skutterudite compound, respectively
Keywords
Seebeck effect; cobalt compounds; electrical conductivity; grain boundaries; grain size; lanthanum compounds; nanostructured materials; sintering; thermal conductivity; 700 K; CoSb3; La0.3FeCo3Sb12; Seebeck coefficient; Skutterudite compounds; electrical conductivity; grain boundaries; grain size; in-situ spark plasma sintering; nanostructure materials; thermal conductivity; thermoelectric figure-of-merit; thermoelectric properties; Conducting materials; Grain boundaries; Grain size; Nanostructured materials; Plasma density; Plasma materials processing; Plasma properties; Sparks; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location
Vienna
ISSN
1094-2734
Print_ISBN
1-4244-0811-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2006.331302
Filename
4133258
Link To Document