CBGA vs. CQFP: electrical performance comparison and tradeoff study

Author

Swaminathan, Madhavan ; Smith, Larry

Author_Institution

IBM Corp., East Fishkill, NY, USA

fYear

1994

fDate

2-4 Nov 1994

Firstpage

10

Lastpage

13

Abstract

Often a product engineer has a wide array of electronic packages that he can choose from for his application. The package that he finally chooses is a trade-off between the cost vs performance of the various packages. This paper discusses the performance comparison between two types of packages namely the ceramic quad flat pack (CQFP) and ceramic ball grid array (CBGA). Typically packages are compared in terms of the lead resistances, inductances and capacitances which rarely provide details on the effect of these parameters at the systems level. This paper looks at the package comparison with considerable emphasis placed on the system by including the details of the onchip metallization and second level (PCB) package parasitics

Keywords

integrated circuit packaging; CBGA; CQFP; capacitances; ceramic ball grid array; ceramic quad flat pack; electrical performance; electronic packages; inductances; lead resistances; onchip metallization; second level package parasitics; CMOS technology; Ceramics; Costs; Electronics packaging; Flip chip; Lead; Metallization; Parasitic capacitance; Semiconductor device modeling; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on

Conference_Location

Monterey, CA

Print_ISBN

0-7803-2411-0

Type

conf

DOI

10.1109/EPEP.1994.594044

Filename

594044