Three-DOF CMOS-MEMS probes with embedded piezoresistive sensors

Author

Liu, J. ; Draghi, L. ; Bain, J.A. ; Schlesinger, T.E. ; Fedder, G.K.

Author_Institution

Carnegie Mellon Univ., Pittsburgh, PA, USA

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

284

Lastpage

287

Abstract

We report on a new 3-DOF CMOS-MEMS electrothermal probe, featuring embedded piezoresistive sensors. These probes have the potential to be used independently for general 3-DOF nanoscale manipulation/manufacturing/scanning without external actuation and sensing. In this probe design, 3-DOF piezoresistive sensors are used to track probe actuation and applied force in all three directions, and thermal management such as dummy heater beams and metal-slotted thermal isolation structures are used to improve drive sensitivity.

Keywords

CMOS integrated circuits; micromechanical devices; piezoresistive devices; probes; sensors; 3-DOF CMOS MEMS electrothermal probe; 3-DOF piezoresistive sensors; complementary metal-oxide-semiconductor; dummy heater beams; embedded piezoresistive sensors; metal-slotted thermal isolation structures; microelectromechanical system; probe actuation; thermal management; Actuators; Atomic force microscopy; Capacitive sensors; Electrothermal effects; Force sensors; Grippers; Piezoresistance; Probes; Thermal force; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442511

Filename

5442511