DocumentCode
2012366
Title
Measuring methods applicable to Thermoelectric Materials: Fraunhofer-IPM capabilities and services
Author
Jacquot, A. ; König, J. ; Böttner, H.
Author_Institution
Dept. of Component & Microsystems, Fraunhofer-Inst. fur Physikalische Messtechnik, Freiburg
fYear
2006
fDate
6-10 Aug. 2006
Firstpage
184
Lastpage
188
Abstract
Over the past decade Fraunhofer-IPM implemented various measurement techniques applicable to thin films and bulk materials. Fraunhofer-IPM is now developing customer-oriented measurement systems especially adapted for thermoelectric materials. They are combining accuracy, rapidity, little efforts for sample mounting, and are fully automated as far as the data acquisition is concerned. The following measurement techniques and their implementation at IPM will be presented: an integrated (acquisition and data interpretation) 3 omega-system for the measurement of the thermal conductivity and heat capacity, two push-button measuring-stations for the measurement of the electrical conductivity and the Seebeck coefficient at room temperature, and a new fully automated station for the measurement of the Seebeck coefficient at high temperatures. For the last mentioned measurement method, which will be discussed in detail, pressure contacts are used for contacting the thermocouples to the sample and the sample to the heat sink, making the measurement of both thin films and bulk materials possible, with a great flexibility on their geometrical dimensions. Finally, the validation of all methods is discussed in terms of suitability and availability of test-samples
Keywords
Seebeck effect; electrical conductivity measurement; measurement systems; specific heat; thermal conductivity measurement; thermocouples; Fraunhofer-IPM capabilities; Fraunhofer-IPM services; Seebeck coefficient measurement; automated data acquisition; bulk materials; data acquisition-interpretation integrated 3 omega-system; electrical conductivity measurement; heat capacity measurement; heat sink; measurement techniques; pressure contacts; thermal conductivity measurement; thermocouples; thermoelectric materials; thin films; Conducting materials; Conductivity measurement; Contacts; Electric variables measurement; Measurement techniques; Pressure measurement; Temperature; Thermal conductivity; Thermoelectricity; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location
Vienna
ISSN
1094-2734
Print_ISBN
1-4244-0811-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2006.331329
Filename
4133267
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