• DocumentCode
    2012455
  • Title

    Advancements on reliability-aware analog circuit design

  • Author

    Ardouin, B. ; Dupuy, J.-Y. ; Godin, J. ; Nodjiadjim, V. ; Riet, M. ; Marc, F. ; Koné, G.A. ; Ghosh, S. ; Grandchamp, B. ; Maneux, C.

  • Author_Institution
    XMOD Technol., Bordeaux, France
  • fYear
    2012
  • fDate
    17-21 Sept. 2012
  • Firstpage
    62
  • Lastpage
    68
  • Abstract
    This paper presents a new physics-based method for reliability prediction and modeling of Integrated Circuits (ICs). By implementing transistor degradation mechanisms via differential equations in the transistor compact model, the aging of the circuit can be simulated over (accelerated) time under real conditions. Actually, each transistor in the circuit integrates the voltage, current and temperature stress it suffers which results in (slowly) varying model parameters over time. Due to its straightforward implementation in commercial Computer Aided Design (CAD) flows, this method allows designers creating reliability-aware circuit architectures at an early stage of the design procedure, well before real circuits are actually fabricated. Application examples and results are presented for an InP/InGaAs DHBT process, but the universality of the method makes it suitable also for silicon based technologies such as CMOS and (SiGe) BiCMOS.
  • Keywords
    BiCMOS analogue integrated circuits; CMOS analogue integrated circuits; circuit CAD; differential equations; heterojunction bipolar transistors; integrated circuit modelling; integrated circuit reliability; transistor circuits; BiCMOS; CAD flows; DHBT process; circuit aging; computer aided design flows; design procedure; differential equations; integrated circuits modelling; physics-based method; reliability prediction; reliability-aware analog circuit design advancements; reliability-aware circuit architectures; silicon based technology; straightforward implementation; transistor compact model; transistor degradation mechanisms; varying model parameters; Aging; Degradation; Integrated circuit modeling; Mathematical model; Reliability; Stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference (ESSDERC), 2012 Proceedings of the European
  • Conference_Location
    Bordeaux
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4673-1707-8
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2012.6343334
  • Filename
    6343334