Peltier effect in sub-micron-sized metallic junctions

Heating in sub-micron-sized electronic circuits becomes a serious problem, especially in high-density integrated circuits (IC). A cooling method, which can suppress the heating inside the electronic circuits, is strongly required. Recently we reported [Fukushima, A, et. al., 2005; Fukushima, A, et. al., 2005] that Peltier cooling in sub-micron-sized current-perpendicular-to-plane metallic-junctions (CPP-MJ) with Co/Au and Cr/Au interfaces, and found that estimated Peltier coefficients of CPP-MJs are larger than those of bulk materials. In this presentation, we report the progress of our recent works on Peltier effects in sub-micron-sized CPP-MJs