Title :
Tactile and shear stress sensing array using capacitive mechanisms with floating electrodes
Author :
Cheng, M.-Y. ; Lin, C.-L. ; Yang, Y.-J.
Author_Institution :
Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
This work presents the development of a capacitive tactile and shear-stress sensing array which can be easily and reliably fabricated by using MEMS techniques and flexible printed circuit board (FPCB) technologies. The sensing array consists of two micromachined PDMS structures and an FPCB with sensing electrodes. Each shear sensing element comprises four capacitive sensing element arranged in 2Ã2 array, and each capacitive sensing element has two sensing electrodes and a common floating electrode. The proposed design can effectively reduce the complexity of the capacitor structure without compromise in sensitivity.
Keywords :
electrodes; micromechanical devices; printed circuits; shear strength; tactile sensors; FPCB technology; MEMS fabrication techniques; capacitive sensing element; capacitive tactile sensing array; capacitor structure; flexible printed circuit board technology; floating electrodes; micromachined PDMS structures; sensing electrodes; sensitivity; shear stress sensing array; Capacitors; Electrodes; Flexible printed circuits; Force sensors; Integrated circuit interconnections; Micromechanical devices; Robot sensing systems; Sensor arrays; Stress; Tactile sensors;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442525