• DocumentCode
    2012602
  • Title

    Tactile and shear stress sensing array using capacitive mechanisms with floating electrodes

  • Author

    Cheng, M.-Y. ; Lin, C.-L. ; Yang, Y.-J.

  • Author_Institution
    Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    228
  • Lastpage
    231
  • Abstract
    This work presents the development of a capacitive tactile and shear-stress sensing array which can be easily and reliably fabricated by using MEMS techniques and flexible printed circuit board (FPCB) technologies. The sensing array consists of two micromachined PDMS structures and an FPCB with sensing electrodes. Each shear sensing element comprises four capacitive sensing element arranged in 2×2 array, and each capacitive sensing element has two sensing electrodes and a common floating electrode. The proposed design can effectively reduce the complexity of the capacitor structure without compromise in sensitivity.
  • Keywords
    electrodes; micromechanical devices; printed circuits; shear strength; tactile sensors; FPCB technology; MEMS fabrication techniques; capacitive sensing element; capacitive tactile sensing array; capacitor structure; flexible printed circuit board technology; floating electrodes; micromachined PDMS structures; sensing electrodes; sensitivity; shear stress sensing array; Capacitors; Electrodes; Flexible printed circuits; Force sensors; Integrated circuit interconnections; Micromechanical devices; Robot sensing systems; Sensor arrays; Stress; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442525
  • Filename
    5442525