DocumentCode
2012602
Title
Tactile and shear stress sensing array using capacitive mechanisms with floating electrodes
Author
Cheng, M.-Y. ; Lin, C.-L. ; Yang, Y.-J.
Author_Institution
Nat. Taiwan Univ., Taipei, Taiwan
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
228
Lastpage
231
Abstract
This work presents the development of a capacitive tactile and shear-stress sensing array which can be easily and reliably fabricated by using MEMS techniques and flexible printed circuit board (FPCB) technologies. The sensing array consists of two micromachined PDMS structures and an FPCB with sensing electrodes. Each shear sensing element comprises four capacitive sensing element arranged in 2Ã2 array, and each capacitive sensing element has two sensing electrodes and a common floating electrode. The proposed design can effectively reduce the complexity of the capacitor structure without compromise in sensitivity.
Keywords
electrodes; micromechanical devices; printed circuits; shear strength; tactile sensors; FPCB technology; MEMS fabrication techniques; capacitive sensing element; capacitive tactile sensing array; capacitor structure; flexible printed circuit board technology; floating electrodes; micromachined PDMS structures; sensing electrodes; sensitivity; shear stress sensing array; Capacitors; Electrodes; Flexible printed circuits; Force sensors; Integrated circuit interconnections; Micromechanical devices; Robot sensing systems; Sensor arrays; Stress; Tactile sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442525
Filename
5442525
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