DocumentCode :
2012690
Title :
Cooling Enhancement Using Inhomogeneous Thermoelectric Materials
Author :
Bian, Zhixi ; Shakouri, Ali
Author_Institution :
Baskin Sch. of Eng., California Univ., Santa Cruz, CA
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
264
Lastpage :
267
Abstract :
The maximum cooling temperature of a thermoelectric refrigerator made of uniform bulk material is limited by its dimensionless figure-of-merit ZT. Cascaded stages are typically needed in order to obtain a higher cooling temperature. Multiple stage configurations have disadvantages of device complexity, and reduced efficiency due to the non-ideal heat spreading between different stages. In this paper, we prove that the maximum cooling temperature can be increased by using a single stage made of inhomogeneous material. This optimization is different from conventional graded materials where there is a large temperature gradient and local material properties are optimized in order to achieve the highest ZT at the local temperature under operation. The new optimization is attributed to the redistribution of the Joule heating and Peltier cooling profiles along the current and heat flow directions. The cooling efficiency can also be increased by a moderate amount. Numerical simulations are used to optimize the doping profile for a thermoelectric cooler based on single crystal silicon
Keywords :
Peltier effect; cooling; doping profiles; electrical conductivity; electrical resistivity; refrigeration; thermal conductivity; thermal management (packaging); Joule heating profile; Peltier cooling profile; Si; cooling enhancement; current flow direction; device complexity; figure of merit; heat flow direction; inhomogeneous thermoelectric materials; maximum cooling temperature; nonideal heat spreading; reduced cooling efficiency; single crystal silicon; single stage cooling; thermoelectric cooler doping profile; thermoelectric refrigerator; Composite materials; Conducting materials; Cooling; Crystalline materials; Refrigeration; Resistance heating; Silicon; Temperature; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331365
Filename :
4133284
Link To Document :
بازگشت