• DocumentCode
    2012702
  • Title

    Active strain modulation in field effect devices

  • Author

    Van Hemert, Tom ; Hueting, Raymond J E

  • Author_Institution
    MESA + Inst. for Nanotechnol., Univ. of Twente, Enschede, Netherlands
  • fYear
    2012
  • fDate
    17-21 Sept. 2012
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    In this work we propose a novel feature for the transistor: a piezo-electric layer for strain modulation of the channel. The strain is formed at strong inversion only, to obtain a lower threshold voltage, but will be absent in the off-state to preserve the unstrained leakage current. Our results, obtained by combining electrical and mechanical finite element method simulation, demonstrate a seven mV/dec steeper subthreshold swing for a classical SOI transistor and ten mV/dec improvement for a silicon tunnel field effect transistor.
  • Keywords
    elemental semiconductors; field effect transistors; finite element analysis; leakage currents; silicon; silicon-on-insulator; tunnelling; SOI transistor; Si; active strain modulation; channel strain modulation; electrical finite element method simulation; field effect device; mechanical finite element method simulation; piezoelectric layer; silicon tunnel field effect transistor; subthreshold swing; threshold voltage; unstrained leakage current; FETs; Modulation; Silicon; Strain; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference (ESSDERC), 2012 Proceedings of the European
  • Conference_Location
    Bordeaux
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4673-1707-8
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2012.6343349
  • Filename
    6343349