DocumentCode
2012702
Title
Active strain modulation in field effect devices
Author
Van Hemert, Tom ; Hueting, Raymond J E
Author_Institution
MESA + Inst. for Nanotechnol., Univ. of Twente, Enschede, Netherlands
fYear
2012
fDate
17-21 Sept. 2012
Firstpage
125
Lastpage
128
Abstract
In this work we propose a novel feature for the transistor: a piezo-electric layer for strain modulation of the channel. The strain is formed at strong inversion only, to obtain a lower threshold voltage, but will be absent in the off-state to preserve the unstrained leakage current. Our results, obtained by combining electrical and mechanical finite element method simulation, demonstrate a seven mV/dec steeper subthreshold swing for a classical SOI transistor and ten mV/dec improvement for a silicon tunnel field effect transistor.
Keywords
elemental semiconductors; field effect transistors; finite element analysis; leakage currents; silicon; silicon-on-insulator; tunnelling; SOI transistor; Si; active strain modulation; channel strain modulation; electrical finite element method simulation; field effect device; mechanical finite element method simulation; piezoelectric layer; silicon tunnel field effect transistor; subthreshold swing; threshold voltage; unstrained leakage current; FETs; Modulation; Silicon; Strain; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference (ESSDERC), 2012 Proceedings of the European
Conference_Location
Bordeaux
ISSN
1930-8876
Print_ISBN
978-1-4673-1707-8
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2012.6343349
Filename
6343349
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