DocumentCode :
2012937
Title :
Improving Energy Efficiency of Configurable Caches via Temperature-Aware Configuration Selection
Author :
Noori, Hamid ; Goudarzi, Maziar ; Inoue, Koji ; Murakami, Kazuaki
Author_Institution :
Inst. of Syst. & Inf. Technol., Fukuoka
fYear :
2008
fDate :
7-9 April 2008
Firstpage :
363
Lastpage :
368
Abstract :
Active power used to be the primary contributor to total power dissipation of CMOS designs, but with the technology scaling, the share of leakage in total power consumption of digital systems continues to grow. Temperature is another factor that exponentially increases the leakage current. In this paper, we show the effect of temperature on the optimal (minimum-energy-consuming) cache configuration for low energy embedded systems. Our results show that for a given application and technology, the optimal cache size moves toward smaller caches at higher temperatures, due to the larger leakage. Our results show that using a Temperature-Aware Configurable Cache (TACC), up to 61% energy can be saved for instruction cache and 77% for data cache compared to a configurable cache that has been configured for only the corner case temperature (100degC). The TACC also enhances the performance by up to 28% and 17% for the instruction and data cache, respectively.
Keywords :
CMOS integrated circuits; cache storage; leakage currents; low-power electronics; CMOS designs; configurable caches; energy efficiency; instruction cache; leakage current; temperature-aware configuration selection; total power dissipation; CMOS technology; Circuits; Computer Society; Embedded system; Energy consumption; Energy efficiency; Information technology; Power dissipation; Temperature; Very large scale integration; Configurable Cache; Low Energy Cache; Temperature-Aware Design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Symposium on VLSI, 2008. ISVLSI '08. IEEE Computer Society Annual
Conference_Location :
Montpellier
Print_ISBN :
978-0-7695-3291-2
Electronic_ISBN :
978-0-7695-3170-0
Type :
conf
DOI :
10.1109/ISVLSI.2008.24
Filename :
4556822
Link To Document :
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