• DocumentCode
    2012977
  • Title

    A gate-last In0.53Ga0.47As channel FinFET with Molybdenum source/drain contacts

  • Author

    Zhang, Xingui ; Guo, Hua Xin ; Gong, Xiao ; Yeo, Yee-Chia

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore (NUS), Singapore, Singapore
  • fYear
    2012
  • fDate
    17-21 Sept. 2012
  • Firstpage
    177
  • Lastpage
    180
  • Abstract
    We demonstrated In0.53Ga0.47As channel FinFETs with self-aligned Molybdenum (Mo) contacts for the first time. By using self-aligned Mo contacts formed on in-situ doped n++ In0.53Ga0.47As source and drain, series resistance of ~250 Ω·μm was achieved, which is the lowest value ever reported for In0.53Ga0.47As non-planar devices. A gate-last process was used. FinFET with channel length of 500 nm and EOT of 3 nm has an ION/IOFF of over 105 and peak Gm of 255 μS/μm at VD = 0.5 V.
  • Keywords
    III-V semiconductors; MOSFET; gallium arsenide; indium compounds; molybdenum; EOT; FinFET; In0.53Ga0.47As; channel length; gate-last process; molybdenum source-drain contact; nonplanar device; self-aligned molybdenum contact; series resistance; size 3 nm; size 500 nm; voltage 0.5 V; FinFETs; Indium gallium arsenide; Logic gates; Metals; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference (ESSDERC), 2012 Proceedings of the European
  • Conference_Location
    Bordeaux
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4673-1707-8
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2012.6343362
  • Filename
    6343362