DocumentCode
2013619
Title
Electronic Transport Properties of Te-doped CoSb3 Prepared by Encapsulated Induction Melting
Author
Sin-Wook You ; Kwan-Ho Park ; Soon-Chul Ur ; Il-Ho Kim
Author_Institution
Res. Center for Sustainable ECo-Devices & Mater., Chungju Nat. Univ., Chungbuk
fYear
2006
fDate
6-10 Aug. 2006
Firstpage
443
Lastpage
446
Abstract
Sn-doped CoSb3 skutterudites (CoSb3-ySny) were prepared by encapsulated induction melting and their electronic transport properties were investigated. Carrier concentration increased with increasing the Sn doping content and the Sn dopant could affect the electronic structure of CoSb3 and generate excess charge carriers (holes). However, carrier mobility decreased with increasing the doping content, which indicates that the hole mean free path was reduced by the impurity scattering. Seebeck coefficient decreased with increasing the carrier concentration. Electrical resistivity slightly decreased with increasing the carrier concentration because the carrier mobility was reduced by the impurity scattering as the carrier concentration increased. The lattice thermal conductivity was dominant in the Sn-doped CoSb3 skutterudites. Seebeck coefficient showed a positive value at all temperatures examined and it increased as the temperature increased. Sn-doped CoSb3 lies on the semimetallic range which confirms a highly degenerate semiconductor
Keywords
Seebeck effect; cobalt compounds; degenerate semiconductors; electrical resistivity; hole density; hole mobility; impurity scattering; melting; semiconductor doping; thermal conductivity; tin; CoSb3:Sn; Seebeck coefficient; degenerate semiconductor; electrical resistivity; electronic transport; encapsulated induction melting; hole concentration; hole mobility; impurity scattering; semiconductor doping; skutterudites; thermal conductivity; Charge carriers; Doping; Electric resistance; Impurities; Induction generators; Lattices; Scattering; Temperature; Thermal conductivity; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location
Vienna
ISSN
1094-2734
Print_ISBN
1-4244-0811-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2006.331310
Filename
4133325
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