• DocumentCode
    2013619
  • Title

    Electronic Transport Properties of Te-doped CoSb3 Prepared by Encapsulated Induction Melting

  • Author

    Sin-Wook You ; Kwan-Ho Park ; Soon-Chul Ur ; Il-Ho Kim

  • Author_Institution
    Res. Center for Sustainable ECo-Devices & Mater., Chungju Nat. Univ., Chungbuk
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    443
  • Lastpage
    446
  • Abstract
    Sn-doped CoSb3 skutterudites (CoSb3-ySny) were prepared by encapsulated induction melting and their electronic transport properties were investigated. Carrier concentration increased with increasing the Sn doping content and the Sn dopant could affect the electronic structure of CoSb3 and generate excess charge carriers (holes). However, carrier mobility decreased with increasing the doping content, which indicates that the hole mean free path was reduced by the impurity scattering. Seebeck coefficient decreased with increasing the carrier concentration. Electrical resistivity slightly decreased with increasing the carrier concentration because the carrier mobility was reduced by the impurity scattering as the carrier concentration increased. The lattice thermal conductivity was dominant in the Sn-doped CoSb3 skutterudites. Seebeck coefficient showed a positive value at all temperatures examined and it increased as the temperature increased. Sn-doped CoSb3 lies on the semimetallic range which confirms a highly degenerate semiconductor
  • Keywords
    Seebeck effect; cobalt compounds; degenerate semiconductors; electrical resistivity; hole density; hole mobility; impurity scattering; melting; semiconductor doping; thermal conductivity; tin; CoSb3:Sn; Seebeck coefficient; degenerate semiconductor; electrical resistivity; electronic transport; encapsulated induction melting; hole concentration; hole mobility; impurity scattering; semiconductor doping; skutterudites; thermal conductivity; Charge carriers; Doping; Electric resistance; Impurities; Induction generators; Lattices; Scattering; Temperature; Thermal conductivity; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331310
  • Filename
    4133325