Title :
Summary of additional topics from the session on packaging and reliability
Author :
Johnson, R. Wayne ; Frank, Randy
Author_Institution :
Auburn Univ., AL, USA
Abstract :
High-temperature electronics for automotive applications are discussed. It is reported that, by extending existing technology, automotive electronics can be operated at temperatures between 150°C and 200°C. Automotive load dump and its effect on reliability and future automotive electronics development are also discussed. It is stated that the improved efficiency that can be achieved by operating at higher voltage can easily be offset by the increased component costs if the load dump transient is increased by two or four times its present value
Keywords :
automotive electronics; packaging; reliability; 150 to 200 degC; automotive electronics; efficiency; load dump; packaging; reliability;
Conference_Titel :
Automotive Power Electronics, 1989
Conference_Location :
Dearborn, MI
DOI :
10.1109/APE.1989.97164
