Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

Author

Jiang, C. ; Krozer, V. ; Bach, H.-G. ; Mekonnen, G.G. ; Johansen, T.K.

Author_Institution

Dept. of Electr. Eng., Tech. Univ. of Denmark, Lyngby, Denmark

fYear

2009

fDate

Sept. 29 2009-Oct. 1 2009

Firstpage

1369

Lastpage

1372

Abstract

In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates approximately 100 GHz 3 dB bandwidth.

Keywords

packaging; photodetectors; 3D electromagnetic simulation; PD chips; coplanar waveguide; interconnection design; interconnection structures; photodetector modules; transmission application; ultra broadband packaging; wire-bonding technology; Bandwidth; Coplanar waveguides; Data communication; Dielectric loss measurement; Electromagnetic waveguides; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Millimeter wave integrated circuits; Photodetectors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2009. EuMC 2009. European

Conference_Location

Rome

Print_ISBN

978-1-4244-4748-0

Type

conf

Filename

5296017