DocumentCode :
2014467
Title :
Lifetime Reliability-Aware Checkpointing Mechanism: Modelling and Analysis
Author :
bin Bandan, Mohamad Imran ; Bhattacharjee, Sangeeta ; Shafik, Rishad Ahmed ; Pradhan, D.K. ; Mathew, Jinesh
Author_Institution :
Univ. of Bristol, Bristol, UK
fYear :
2013
fDate :
10-12 Dec. 2013
Firstpage :
128
Lastpage :
132
Abstract :
Check pointing mechanism is used to tolerate the impact of transient faults through roll-back operation to a previously saved system state. In this paper, we propose a novel check pointing mechanism that considers fault tolerance in a duplex system in the presence of both transient and permanent faults. The main objective of our proposed mechanism is to extend the lifetime reliability of the duplex system by avoiding or even tolerating permanent faults in microprocessors. In addition, we also propose to migrate tasks from a ´near-to-die´ processor to a spare processor under a condition where the current Mean-Time-To-Failure (MTTF) value is less or equal to a pre-determined threshold MTTF value. We validate our proposed mechanism and perform overhead analysis using various case studies. Later, we compare it with one of the most popular existing check pointing mechanism, namely the roll-forward check pointing scheme [9]. We show that unlike roll-back or roll-forward mechanisms, our proposed mechanism gives significantly higher lifetime reliability with reasonable system overheads.
Keywords :
integrated circuit reliability; microprocessor chips; MTTF; duplex system lifetime reliability; lifetime reliability-aware checkpointing mechanism; mean-time-to-failure; microprocessors; near-to-die processor; permanent faults; roll-forward check pointing scheme; transient faults; Built-in self-test; Checkpointing; Circuit faults; Registers; Reliability engineering; Transient analysis; Checkpointing; fault tolerance; lifetime reliability; microprocessors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System Design (ISED), 2013 International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-0-7695-5143-2
Type :
conf
DOI :
10.1109/ISED.2013.32
Filename :
6808655
Link To Document :
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