DocumentCode :
2014555
Title :
Numerical Analysis of Effective Thermal Conductivity in Microwire Array Element
Author :
Kuraishi, M. ; Komine, T. ; Teramoto, T. ; Sugita, R. ; Hasegawa, Y.
Author_Institution :
Dept. of Media & Telecomm. Eng., Ibaraki Univ., Hitachi
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
582
Lastpage :
585
Abstract :
In this study, we have developed a three-dimensional finite element method for solving the equations of electrical and thermal flows. The 3D analysis of bulk material and wire array element was demonstrated, and electrical potential and temperature distributions were calculated in thermoelectric elements of bulk bismuth and wire array structures for various boundary conditions. The influence of wire array structure on effective thermal conductivity of the element was discussed in this study. It was clarified that thermal exchange between bismuth wire and glass template in wire array element plays a very important role for reduction of thermal conductivity
Keywords :
bismuth; electric potential; finite element analysis; thermal conductivity; thermoelectricity; 3D finite element method; Bi; bismuth; effective thermal conductivity; electrical flows; electrical potential; microwire array element; thermal exchange; thermal flows; thermoelectric elements; Bismuth; Conducting materials; Electric potential; Equations; Finite element methods; Numerical analysis; Temperature distribution; Thermal conductivity; Thermoelectricity; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331381
Filename :
4133360
Link To Document :
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