DocumentCode :
2016416
Title :
Ti-O film deposited by DC metal vacuum arc deposition: characteristics and platelet adhesion behavior
Author :
Wan, G.J. ; Leng, Y.X. ; Sun, Hongbin ; Yang, Phil Y. ; Chen, J.Y. ; Wang, Jiacheng ; Huang, Nicole
Author_Institution :
Sch. of Mater. Sci. & Eng., Southwest Jiaotong Univ., Chengdu, China
fYear :
2003
fDate :
5-5 June 2003
Firstpage :
282
Abstract :
Summary form only given, as follows. Ti-O films have been shown to possess excellent blood compatibility based on our prior research work as well as that of other researchers. Some attempts have been taken to synthesize Ti-O films on cardiovascular implants to modify their surface properties. In this research, a DC Metal Vacuum Arc Deposition technique was used, with its advantages (such as good control of the sample composition and structure, high deposition efficiency, high adhesion, as well as good mechanical properties), to deposit Ti-O films on silicon wafers. Platelet adhesion tests were carried out for evaluation of the blood compatibility of the Ti-O films, the results show that the platelet adhesion behavior of the deposited Ti-O films is better than that of LTIC and naturally oxidized TiO/sub 2/, and samples deposited in higher vacuum (low O/sub 2/ pressure) are better than those deposited in poorer vacuum. Almost no platelet aggregation and pseudopodium have been observed on the best Ti-O film, while serious aggregation as well as pseudopodium was found on LTIC material, which has been clinically applied for cardiovascular artificial organs for decades.
Keywords :
adhesion; aggregation; biomedical materials; blood; cellular biophysics; plasma deposited coatings; titanium compounds; vacuum deposited coatings; DC metal vacuum arc deposition; Ti-O; Ti-O film; blood compatibility; cardiovascular artificial organs; cardiovascular implants; good mechanical properties; high adhesion; high deposition efficiency; platelet adhesion behavior; sample composition; structure; surface properties; Adhesives; Blood; Cardiology; Implants; Mechanical factors; Semiconductor films; Silicon; Testing; Vacuum arcs; Vacuum technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location :
Jeju, South Korea
ISSN :
0730-9244
Print_ISBN :
0-7803-7911-X
Type :
conf
DOI :
10.1109/PLASMA.2003.1228831
Filename :
1228831
Link To Document :
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