Title :
Electromigration lifetime enhancement for lines with multiple branches
Author :
Dion, Michael J.
Author_Institution :
Intersil Corp., Melbourne, FL, USA
Abstract :
With clock or power supply interconnect “trees” there is often a very high current “trunk” feeding current to multiple branches. This work demonstrates and discusses increased “trunk” lifetime with increasing numbers of current branches in a plug-via metal system. The branches act as reservoirs or sources of additional Al and Cu ions, which can re-fill portions of voids and/or slow void growth. It is discussed that any area of metal at a lower current density might be considered a reservoir or source of metal ions for higher current density regions, and can effectively extend the lifetime of the higher current density region. Comparative Black´s model parameters are developed and failure analysis is described
Keywords :
current density; electromigration; failure analysis; integrated circuit interconnections; Black´s model; current density; electromigration lifetime; interconnect trees; multiple branches; plug-via metal system; trunk lifetime; void growth; Clocks; Conductors; Current density; Electromigration; Electrons; Failure analysis; Industrial relations; Power supplies; Power system interconnection; Reservoirs;
Conference_Titel :
Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5860-0
DOI :
10.1109/RELPHY.2000.843934