Improvement of Au adhesion on parylene-c and SiO/sub 2/ substrates using oxygen plasma treatment

Author

Lee, J.H. ; Hwang, K.S. ; Yoon, K.H. ; Kim, T.S. ; Ahn, Seungyoung

Author_Institution

Mcrosystem Res. Center, KIST, Seoul, South Korea

fYear

2003

fDate

5-5 June 2003

Firstpage

292

Abstract

Summary form only given, as follows. Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidate for low dielectric materials for the application of biosensors such as DNA and protein chip Pa-c and SiO/sub 2/ films are deposited on a Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using the e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO/sub 2/ surfaces, surface modification of Pa-c and SiO/sub 2/ was performed using oxygen plasma. Pa-c and SiO/sub 2/ layers were exposed to an oxygen plasma using a reactive ion etcher at various power and times.

Keywords

adhesion; gold; plasma CVD coatings; plasma deposition; silicon compounds; Au; Au adhesion; LPCVD; SiO/sub 2/; SiO/sub 2/ substrates; e-beam evaporation method; parylene-c; vapor deposition; Adhesives; Biosensors; Chemicals; DNA; Dielectric materials; Dielectric substrates; Gold; Moisture; Plasma applications; Proteins;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on

Conference_Location

Jeju, South Korea

ISSN

0730-9244

Print_ISBN

0-7803-7911-X

Type

conf

DOI

10.1109/PLASMA.2003.1228851

Filename

1228851