Title :
A study of strain gage test during PCB assembly process
Author :
Zou, Yabing ; Xiao, Hui
Author_Institution :
Reliability Research and Analysis Center, China Ceprei Laboratory, Guangzhou, China
Abstract :
Stress-induced solder joint failure is one of the most common modes of printed circuit board assembly (PCBA) failures. Various assembly and test processes can cause solder joint failures on PCBAs by over-flexing them even before they are shipped out. This paper will discuss the strain gage test method, the test procedure and the typical application.
Keywords :
Films; Instruments; Joints; Monitoring; Soldering; Strain; Substrates; Hazardous Process Discrimination; PCB Assembly; Strain Gage;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236560
