• DocumentCode
    2017464
  • Title

    Hermeticity Testing and Failure Analysis of MEMS Packages

  • Author

    De Wolf ; Jourdain, Anne ; De Moor, P. ; Tilmans, Harrie A. C. ; Marchand, Laurent

  • Author_Institution
    IMEC, Leuven
  • fYear
    2007
  • fDate
    11-13 July 2007
  • Abstract
    Several microsystem applications require hermetic or semi- hermetic packages. It is for this reason mandatory to be able to check the hermeticity of these packages. The standard tests, using gross leak and fine leak, work very well for large cavities, but might give erroneous results for small cavities as typically used for MEMS. We discussed different alternative test methods.
  • Keywords
    failure analysis; micromechanical devices; packaging; MEMS packages; failure analysis; hermeticity testing; large cavities; microsystem; semihermetic packages; Detectors; Failure analysis; Leak detection; Micromechanical devices; Packaging; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
  • Conference_Location
    Bangalore
  • Print_ISBN
    978-1-4244-1014-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2007.4378075
  • Filename
    4378075
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2017464