The numerical investigation on mechanical behavior of BGA packages under board-level by using shear cycling loading

This paper establishes the specific construction of BGA packages under board-level by using the finite element analysis software. Study the cycling shear loading mechanical behavior of the BGA packages under board-level in different cycling times, shear loading value and the number of solder joints. The result shows that position or area to the joint which has the biggest stress and strain is unchanged to the specific construction of BGA package under board-level through the whole cycling shear loading process. And the phenomenon will become more obvious with the increase of the number of solder joints. The largest stress and strain zone is the downward part of the first solder joint which is far away from the loading. The residual stress and strain of each solder joint to BGA package under board-level will increase while the cycling shear loading times increase. And the resistance ability to strain will increase with the increase of the number of solder joints under the same shear loading condition.