DocumentCode
2018038
Title
Electroless plating alloy thin-film embedded resistor materials
Author
Su, Xingsong ; Lai, Lifei ; Li, Chang ; Liu, Wenjun ; Fu, Xian-Zhu ; Sun, Rong ; Wong, C.P.
Author_Institution
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, 518055, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
240
Lastpage
243
Abstract
Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films´ sheet resistance, corrosion resistance and hardness increase with the increase of P content.
Keywords
Assembly; Impedance; Metals; Packaging; Resistance; Ni alloy; corrosion resistance; electroless plating; thin film embedded resistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236584
Filename
7236584
Link To Document