• DocumentCode
    2018173
  • Title

    Effect of electromigration of Sn-xAg-Cu solder joints on its microstructure and mechanical properties

  • Author

    Tian, Shuang ; Wang, Fengjiang ; Li, Dongyang ; Wang, Fengjiang ; He, Peng

  • Author_Institution
    Key Laboratory of Advanced Welding Technology of Jiangsu Province, Jiangsu University of Science and Technology, Zhenjiang, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    256
  • Lastpage
    259
  • Abstract
    In this study, effect of electromigration of Sn-0.7Cu, Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder joints on the microstructure and mechanical properties were investigated. Within a certain range, addition of Ag enhanced the electromigration stressing resistance and the joint strength. Electromigration changed the distribution and morphology of the IMC. In cathode side, the Cu6Sn5 layer reduces with the increasing time, while in anode side, the Cu6Sn5 layer would increased with the increasing time. Electromigration reduced the mechanical properties of linear joints. The drop rate of ultimate tensile strength has a linear relationship with the stressing time. According to the fracture morphology, the fracture mechanism changed from ductile to cleavage fracture.
  • Keywords
    Electromigration; Flip-chip devices; Joints; Lead; Resistance; Ag content; electromigration; joint strength; microstructure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236588
  • Filename
    7236588
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2018173