DocumentCode :
2018270
Title :
Chip-to-chip optical interconnects
Author :
Kash, J.A. ; Doany, F.E. ; Schares, L. ; Schow, C.L. ; Schuster, C. ; Kuchta, D.M. ; Pepeljugoski, P.K. ; Trewhella, J.M. ; Baks, C.W. ; John, R.A. ; Shan, L. ; Kwark, Y.H. ; Budd, R.A. ; Chiniwalla, P. ; Libsch, F.R. ; Rosner, J. ; Tsang, C.K. ; Patel, C
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY
fYear :
2006
fDate :
5-10 March 2006
Abstract :
Terabus is based on a silicon-carrier interposer on an organic card containing 48 polymer waveguides. We have demonstrated 4times12 arrays of low power optical transmitters and receivers, operating up to 20 Gb/s and 14 Gb/s per channel respectively
Keywords :
integrated optics; integrated optoelectronics; optical arrays; optical fibre communication; optical interconnections; optical polymers; optical receivers; optical transmitters; optical waveguides; silicon; 14 Gbit/s; 20 Gbit/s; Si; Terabus; chip-to-chip interconnects; optical interconnects; optical receivers; optical transmitters; organic card; polymer waveguides; silicon-carrier interposer; Assembly; Bonding; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Silicon; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Fiber Communication Conference, 2006 and the 2006 National Fiber Optic Engineers Conference. OFC 2006
Conference_Location :
Anaheim, CA
Print_ISBN :
1-55752-803-9
Type :
conf
DOI :
10.1109/OFC.2006.215933
Filename :
1636964
Link To Document :
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